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What is the basic structure of PCB?

The basic structure of a Printed Circuit Board (PCB) consists of several key components that work together to provide a platform for electronic components and their interconnections.

  1. Substrate: This is the base material of the PCB, typically made from fiberglass or other insulating materials. The substrate provides mechanical support and electrical insulation between the conductive layers. For example, FR-4 is a common substrate material known for its durability and flame resistance.

  2. Copper Layers: These are thin layers of copper foil laminated onto the substrate. Copper is used because it is an excellent conductor of electricity. The number of copper layers can vary depending on the complexity of the circuit, with single-layer, double-layer, and multi-layer PCBs being common. For instance, a double-layer PCB has copper layers on both the top and bottom sides of the substrate.

  3. Solder Mask: This is a protective layer applied over the copper layers to prevent short circuits and protect the copper from oxidation. The solder mask is usually green, but it can be other colors as well. It leaves small openings where components will be soldered.

  4. Silkscreen: This is a layer of ink traces used to mark the positions of components, test points, and other important information on the PCB. The silkscreen is usually white but can be other colors. It helps in the assembly and debugging process by providing clear labels and markings.

  5. Vias: These are small holes drilled through the PCB and plated with conductive material, usually copper. Vias are used to create electrical connections between different layers of the PCB. For example, a via can connect a trace on the top layer to a trace on the bottom layer.

  6. Pads: These are small areas of exposed copper where components are soldered. Pads can be through-hole or surface-mount, depending on the type of component being used. Through-hole pads are larger and designed for components with leads that go through the board, while surface-mount pads are smaller and designed for components that sit directly on the surface of the board.

In the context of cloud computing, if you are designing and testing PCBs for IoT devices, Tencent Cloud offers services like IoT Explorer and IoT Video to help manage and monitor your connected devices efficiently. These services can be integrated with your PCB-based IoT solutions to provide seamless connectivity and data management.